Patent Assignment Details
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| Reel/Frame: | 029534/0476 | |
| Pages: | 3 |
| | Recorded: | 12/27/2012 | | |
| Attorney Dkt #: | 252016-8320 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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11/04/2003
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Application #:
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10065297
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Filing Dt:
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10/01/2002
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Title:
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PROCESS OF FABRICATING FLIP-CHIP INTERCONNECTION STRUCTURE
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Patent #:
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Issue Dt:
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06/01/2004
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Application #:
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10248992
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Filing Dt:
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03/07/2003
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Publication #:
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Pub Dt:
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12/25/2003
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Title:
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FLIP CHIP INTERCONNCETION STRUCTURE AND PROCESS OF MAKING THE SAME
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Assignee
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| NO.8, LI-HSIN ROAD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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MCCLURE, QUALEY & RODACK, LLP
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400 INTERSTATE NORTH PARKWAY SE
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SUITE 200
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ATLANTA, GA 30339
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