Patent Assignment Details
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| Reel/Frame: | 029546/0653 | |
| Pages: | 3 |
| | Recorded: | 12/31/2012 | | |
| Attorney Dkt #: | TSMC2012-0822 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/08/2016
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Application #:
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13679258
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Filing Dt:
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11/16/2012
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Publication #:
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Pub Dt:
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05/22/2014
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Title:
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ULTRA-HIGH VACUUM (UHV) WAFER PROCESSING
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Assignee
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| NO. 8, LI-HSIN ROAD 6 |
| HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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COOPER LEGAL GROUP LLC
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6505 ROCKSIDE ROAD SUITE 330
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INDEPENDENCE, OH 44131
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05/03/2024 04:56 PM
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