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Reel/Frame:029567/0496   Pages: 4
Recorded: 01/04/2013
Attorney Dkt #:0076885-000008
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
13626151
Filing Dt:
09/25/2012
Publication #:
Pub Dt:
03/28/2013
Title:
METHOD FOR HEAT-TREATING SILICON WAFER
Assignors
1
Exec Dt:
10/04/2012
2
Exec Dt:
10/04/2012
3
Exec Dt:
10/04/2012
4
Exec Dt:
10/04/2012
5
Exec Dt:
10/04/2012
Assignee
1
6-861-5, SEIRO-MACHI HIGASHIKO
KITAKANBARA-GUN
NIIGATA, JAPAN
Correspondence name and address
BUCHANAN INGERSOLL & ROONEY PC
1737 KING STREET
SUITE 500
ALEXANDRIA, VA 22314

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