Patent Assignment Details
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| Reel/Frame: | 029600/0488 | |
| Pages: | 4 |
| | Recorded: | 12/27/2012 | | |
| Attorney Dkt #: | 155999 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13807243
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Filing Dt:
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12/27/2012
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Publication #:
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Pub Dt:
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04/25/2013
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Title:
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METHOD FOR HEAT-TREATING WAFER, METHOD FOR PRODUCING SILICON WAFER, SILICON WAFER, AND HEAT TREATMENT APPARATUS
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Assignee
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| 6-2, OHTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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WILLIAM P. BERRIDGE
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OLIFF & BERRIDGE, PLC
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P.O. BOX 320850
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ALEXANDRIA, VA 22320-4850
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