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Reel/Frame:029767/0709   Pages: 6
Recorded: 02/06/2013
Attorney Dkt #:058438-14-0407
Conveyance: RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Total properties: 5
1
Patent #:
Issue Dt:
05/14/2002
Application #:
09633631
Filing Dt:
08/07/2000
Title:
OPTOCOUPLER PACKAGE BEING HERMETICALLY SEALED
2
Patent #:
Issue Dt:
09/02/2003
Application #:
09737408
Filing Dt:
12/15/2000
Publication #:
Pub Dt:
07/03/2003
Title:
INTERCONNECTION METHOD ENTAILING PROTUBERANCES FORMED BY MELTING METAL OVER CONTACT AREAS
3
Patent #:
Issue Dt:
11/07/2006
Application #:
10650265
Filing Dt:
08/28/2003
Title:
INTERCONNECTION METHOD
4
Patent #:
Issue Dt:
09/02/2008
Application #:
10718169
Filing Dt:
11/20/2003
Title:
DIGITAL INTEGRATION METHOD
5
Patent #:
Issue Dt:
09/18/2007
Application #:
10989882
Filing Dt:
11/16/2004
Title:
HIGH DENSITY ELECTRONIC INTERCONNECTION
Assignor
1
Exec Dt:
02/06/2013
Assignee
1
3285 VETERAN'S MEMORIAL HWY, SUITE A-7
RONKONKOMA, NEW YORK 11779
Correspondence name and address
CATHERINE R. HOWELL
1111 PENNSYLVANIA AVE., N.W
MORGAN, LEWIS & BOCKIUS LLP
WASHINGTON, DC 20004

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