Patent Assignment Details
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| Reel/Frame: | 029818/0043 | |
| Pages: | 4 |
| | Recorded: | 02/15/2013 | | |
| Attorney Dkt #: | 1608-241 PCT/US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/21/2021
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Application #:
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13702885
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Filing Dt:
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02/15/2013
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Publication #:
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Pub Dt:
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07/11/2013
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Title:
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METHOD FOR ADHERING RESIN MOLDED ARTICLES
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Assignee
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| 18-1, KONAN 2 CHOME, MINATO-KU |
| TOKYO, JAPAN 108-8280 |
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Correspondence name and address
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DANIEL A. SCOLA, JR.
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6900 JERICHO TURNPIKE
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HOFFMANN & BARON LLP
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SYOSSET, NY 11791
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