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Reel/Frame:029832/0606   Pages: 3
Recorded: 02/19/2013
Attorney Dkt #:CP13005
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
13817709
Filing Dt:
02/19/2013
Publication #:
Pub Dt:
07/17/2014
Title:
Method and Device for Purging Bubbles in the Pipeline of Substrate Coater and Corresponding Substrate Coater
Assignors
1
Exec Dt:
01/31/2013
2
Exec Dt:
01/31/2013
3
Exec Dt:
01/31/2013
Assignee
1
NO.9-2, TANGMING RD, GUANGMING NEW DISTRICT
SHENZHEN CITY, GUANGDONG,, CHINA 518132
Correspondence name and address
CHENG, ANDREW CHIWU
22928 ESTORIL DRIVE
UNIT 5
DIAMOND BAR, CA 91765

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