Patent Assignment Details
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| Reel/Frame: | 029875/0273 | |
| Pages: | 5 |
| | Recorded: | 02/26/2013 | | |
| Attorney Dkt #: | 4030-0301US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/25/2015
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Application #:
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13819038
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Filing Dt:
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02/26/2013
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Publication #:
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Pub Dt:
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06/20/2013
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Title:
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ETCHING METHOD, SUBSTRATE PROCESSING METHOD, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR ELEMENT
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Assignee
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| 3-1 AKASAKA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 107-6325 |
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Correspondence name and address
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ROTHWELL, FIGG, ERNST & MANBECK, P.C.
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607 14TH STREET, N.W.
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SUITE 800
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WASHINGTON, DC 20005
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