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Reel/Frame:029951/0701   Pages: 3
Recorded: 03/08/2013
Attorney Dkt #:LAMRP021/NVLS003808
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/26/2019
Application #:
13753333
Filing Dt:
01/29/2013
Publication #:
Pub Dt:
07/31/2014
Title:
LOW COPPER ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT CONTROL
Assignors
1
Exec Dt:
03/08/2013
2
Exec Dt:
03/08/2013
Assignee
1
4650 CUSHING PARKWAY
FREMONT, CALIFORNIA 94538
Correspondence name and address
WEAVER AUSTIN VILLENEUVE & SAMPSON LLP
P.O. BOX 70250
OAKLAND, CA 94612-0250

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