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Reel/Frame:030010/0165   Pages: 3
Recorded: 03/15/2013
Attorney Dkt #:1022.0029C
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
13804833
Filing Dt:
03/14/2013
Publication #:
US20130243550
Pub Dt:
09/19/2013
Title:
Substrate Processing Apparatus, Method of Processing Substrate, Method of Manufacturing Semiconductor Device and Non Transitory Computer Readable Recording Medium on which Program for Performing Method of Manufacturing Semiconductor Device is Recorded
Assignors
1
YASUI, TAKESHI
Exec Dt:
03/04/2013
2
MATSUURA, NAOYA
Exec Dt:
03/04/2013
3
FUKUDA, MITSURU
Exec Dt:
03/04/2013
4
OGAWA, HIROYUKI
Exec Dt:
03/04/2013
Assignee
1
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME
CHIYODA-KU
TOKYO, JAPAN 1018980
Correspondence name and address
PATRICK J. FINNAN
9801 WASHINGTONIAN BLVD.
SUITE 750
GAITHERSBURG, MD 20878

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