Patent Assignment Details
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| Reel/Frame: | 030024/0390 | |
| Pages: | 3 |
| | Recorded: | 03/16/2013 | | |
| Attorney Dkt #: | HKY-36633 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/31/2015
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Application #:
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13833036
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Filing Dt:
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03/15/2013
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Publication #:
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Pub Dt:
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09/26/2013
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING A METAL PLATE, SEMICONDUCTOR CHIP, AND WIRING STRUCTURE, SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
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Assignee
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| 80, OSHIMADA-MACHI |
| NAGANO-SHI, NAGANO, JAPAN 381-2287 |
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Correspondence name and address
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RANKIN HILL AND CLARK LLP
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38210 GLENN AVENUE
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WILLOUGHBY, OH 44094
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