Patent Assignment Details
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| Reel/Frame: | 030064/0820 | |
| Pages: | 4 |
| | Recorded: | 03/22/2013 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/18/2013
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Application #:
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12321002
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Filing Dt:
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01/14/2009
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Publication #:
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Pub Dt:
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05/20/2010
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Title:
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Heat radiating fin assembly and thermal module formed therefrom
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Assignee
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| A3A01, 4TH FL., WANGJING SCIENCE AND TECHNOLOGY DEVELOPMENT BUILDING, THREE DISTRICT, WANGJING NEW INDUSTRY DISTRICT |
| CHAOYANG DISTRICT, BEIJING CITY, CHINA |
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Correspondence name and address
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BEIJING AVC TECHNOLOGY RESEARCH CENTER
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7FL., NO. 283, SEC. 2, FUSHING S. ROAD
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TAIPEI CITY, 106 TAIWAN
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