Patent Assignment Details
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Reel/Frame: | 030126/0952 | |
| Pages: | 8 |
| | Recorded: | 04/01/2013 | | |
Attorney Dkt #: | 243275.000002 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/16/2014
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Application #:
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13877224
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Filing Dt:
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04/01/2013
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Publication #:
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Pub Dt:
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07/18/2013
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Title:
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BONDING STRUCTURE OF MULTILAYER COPPER BONDING WIRE
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Assignees
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14-1, SOTOKANDA 4-CHOME, CHIYODA-KU |
TOKYO, JAPAN 1010021 |
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158-1 OAZA SAYAMAGAHARA, IRUMA-SHI |
SAITAMA, JAPAN 3580032 |
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Correspondence name and address
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LOUIS J. DELJUIDICE
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TROUTMAN SANDERS LLP
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405 LEXINGTON AVENUE, CHRYSLER BUILDING
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NEW YORK, NY 10174-0700
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