Patent Assignment Details
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| Reel/Frame: | 030172/0188 | |
| Pages: | 2 |
| | Recorded: | 04/08/2013 | | |
| Attorney Dkt #: | T5057-K203A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/30/2014
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Application #:
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13858639
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Filing Dt:
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04/08/2013
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Publication #:
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Pub Dt:
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08/29/2013
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Title:
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INTEGRATED CIRCUITS INCLUDING AIR GAPS AROUND INTERCONNECT STRUCTURES, AND FABRICATION METHODS THEREOF
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Assignee
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| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 30 |
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Correspondence name and address
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LOWE HAUPTMAN HAM & BERNER, LLP (TSMC)
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2318 MILL ROAD
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SUITE 1400
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ALEXANDRIA, VA 22314
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