Patent Assignment Details
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| Reel/Frame: | 030193/0298 | |
| Pages: | 3 |
| | Recorded: | 02/13/2013 | | |
| Attorney Dkt #: | 155824 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13708370
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Filing Dt:
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12/07/2012
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Publication #:
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Pub Dt:
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06/12/2014
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Title:
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THERMOSETTING RESIN COMPOSITIONS, RESIN FILMS IN B-STAGE, METAL FOILS, COPPER CLAD BOARDS AND MULTI LAYER BUILD-UP BOARDS
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Assignee
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| 1-19-43, HIGASHI-OIZUMI, |
| NERIMA-KU, TOKYO, 178-8511, JAPAN |
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Correspondence name and address
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JAMES A. OLIFF
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OLIFF & BERRIDGE, PLC
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P.O. BOX 320850
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ALEXANDRIA, VA 22320-4850
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