Patent Assignment Details
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| Reel/Frame: | 030250/0584 | |
| Pages: | 8 |
| | Recorded: | 04/19/2013 | | |
| Attorney Dkt #: | 6120-0126PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13880186
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Filing Dt:
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04/18/2013
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Publication #:
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Pub Dt:
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10/31/2013
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Title:
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RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE
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Assignee
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 140-0002 |
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Correspondence name and address
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BIRCH, STEWART, KOLASCH, & BIRCH, LLP.
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P.O. BOX 747
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FALLS CHURCH, VA 22040-0747
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