Patent Assignment Details
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| Reel/Frame: | 030283/0798 | |
| Pages: | 5 |
| | Recorded: | 04/25/2013 | | |
| Attorney Dkt #: | 2012.1372/1085.01203 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/25/2017
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Application #:
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13870025
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Filing Dt:
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04/25/2013
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Publication #:
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Pub Dt:
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09/18/2014
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Title:
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SYSTEMS AND METHODS OF COMPENSATING FOR FILLING MATERIAL LOSSES IN ELECTROPLATING PROCESSES
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Assignee
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| NO.8, LI-HSIN ROAD 6 |
| HSINCHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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DUANE MORRIS LLP (TSMC) IP DEPARTMENT
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30 SOUTH 17TH STREET
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PHILADELPHIA, PA 19103-4196
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