Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 030307/0322 | |
| Pages: | 7 |
| | Recorded: | 04/29/2013 | | |
Attorney Dkt #: | 2515.0428 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/02/2016
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Application #:
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13853810
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Filing Dt:
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03/29/2013
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Publication #:
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Pub Dt:
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10/02/2014
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Title:
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Methods of Manufacturing Flip Chip Semiconductor Packages Using Double-Sided Thermal Compression Bonding
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Assignee
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10 ANG MO KIO STREET 65 |
#05-17/20 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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PATENT LAW GROUP: ATKINS & ASSOCIATES
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605 W. KNOX ROAD
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SUITE 104
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TEMPE, AZ 85284
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