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Patent #:
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Issue Dt:
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10/26/2004
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Application #:
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10322527
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Filing Dt:
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12/19/2002
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Publication #:
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Pub Dt:
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06/24/2004
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Title:
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CIRCUITIZED SUBSTRATE ASSEMBLY AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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06/14/2005
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Application #:
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10370529
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Filing Dt:
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02/24/2003
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Publication #:
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Pub Dt:
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08/26/2004
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Title:
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CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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03/29/2005
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Application #:
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10379575
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Filing Dt:
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03/06/2003
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Publication #:
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Pub Dt:
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06/24/2004
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Title:
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INFORMATION HANDLING SYSTEM UTILIZING CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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04/25/2006
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Application #:
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10394107
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Filing Dt:
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03/24/2003
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Publication #:
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Pub Dt:
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08/05/2004
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Title:
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MULTI-CHIP ELECTRONIC PACKAGE HAVING LAMINATE CARRIER AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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04/04/2006
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Application #:
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10394135
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Filing Dt:
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03/24/2003
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Publication #:
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Pub Dt:
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08/05/2004
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Title:
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INFORMATION HANDLING SYSTEM
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Patent #:
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Issue Dt:
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10/25/2005
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Application #:
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10409066
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Filing Dt:
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04/09/2003
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Publication #:
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Pub Dt:
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10/14/2004
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Title:
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MATERIAL SEPARATION TO FORM SEGMENTED PRODUCT
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Patent #:
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Issue Dt:
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11/09/2004
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Application #:
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10423877
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Filing Dt:
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04/28/2003
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Publication #:
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Pub Dt:
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09/23/2004
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Title:
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ELECTRONIC PACKAGE WITH STRENGTHENED CONDUCTIVE PAD
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Patent #:
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Issue Dt:
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08/08/2006
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Application #:
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10423972
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Filing Dt:
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04/28/2003
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Publication #:
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Pub Dt:
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09/23/2004
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Title:
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PINNED ELECTRONIC PACKAGE WITH STRENGTHENED CONDUCTIVE PAD
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Patent #:
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Issue Dt:
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03/21/2006
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Application #:
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10616932
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Filing Dt:
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07/11/2003
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Publication #:
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Pub Dt:
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01/13/2005
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Title:
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Method of testing spacings in pattern of openings in PCB conductive layer
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Patent #:
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Issue Dt:
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09/19/2006
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Application #:
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10630722
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Filing Dt:
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07/31/2003
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Publication #:
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Pub Dt:
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02/03/2005
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Title:
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ELECTRONIC COMPONENT TEST APPARATUS
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Patent #:
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Issue Dt:
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06/20/2006
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Application #:
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10643909
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Filing Dt:
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08/20/2003
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Publication #:
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Pub Dt:
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02/24/2005
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Title:
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CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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01/31/2006
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Application #:
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10661616
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Filing Dt:
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09/15/2003
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Publication #:
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Pub Dt:
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08/05/2004
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Title:
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STACKED CHIP ELECTRONIC PACKAGE HAVING LAMINATE CARRIER AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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08/01/2006
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Application #:
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10679302
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Filing Dt:
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10/07/2003
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Publication #:
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Pub Dt:
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04/07/2005
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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05/01/2007
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Application #:
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10737974
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Filing Dt:
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12/18/2003
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Publication #:
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Pub Dt:
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06/23/2005
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Title:
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Method of making multilayered printed circuit board with filled conductive holes
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Patent #:
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Issue Dt:
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02/13/2007
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Application #:
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10740398
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Filing Dt:
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12/22/2003
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Publication #:
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Pub Dt:
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06/23/2005
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Title:
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PRINTED CIRCUIT BOARD WITH LOW CROSS-TALK NOISE
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Patent #:
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Issue Dt:
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09/21/2010
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Application #:
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10740500
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Filing Dt:
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12/22/2003
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Publication #:
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Pub Dt:
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06/23/2005
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Title:
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ITEM IDENTIFICATION CONTROL METHOD
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Patent #:
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Issue Dt:
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04/24/2007
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Application #:
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10790747
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Filing Dt:
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03/03/2004
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Publication #:
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Pub Dt:
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09/08/2005
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Title:
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CIRCUITIZED SUBSTRATE WITH SIGNAL WIRE SHIELDING, ELECTRICAL ASSEMBLY UTILIZING SAME AND METHOD OF MAKING
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Patent #:
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Issue Dt:
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12/26/2006
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Application #:
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10811817
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Filing Dt:
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03/30/2004
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Publication #:
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Pub Dt:
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11/25/2004
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Title:
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METHOD OF MAKING HIGH SPEED CIRCUIT BOARD
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Patent #:
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Issue Dt:
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05/23/2006
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Application #:
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10811915
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Filing Dt:
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03/30/2004
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Publication #:
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Pub Dt:
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09/16/2004
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE ASSEMBLY
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Patent #:
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Issue Dt:
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09/18/2007
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Application #:
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10812889
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Filing Dt:
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03/31/2004
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Publication #:
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Pub Dt:
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10/13/2005
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Title:
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DIELECTRIC COMPOSITION FOR FORMING DIELECTRIC LAYER FOR USE IN CIRCUITIZED SUBSTRATES
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Patent #:
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Issue Dt:
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07/18/2006
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Application #:
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10812890
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Filing Dt:
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03/31/2004
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Publication #:
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Pub Dt:
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10/13/2005
| | | | |
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Title:
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CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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06/23/2009
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Application #:
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10860067
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Filing Dt:
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06/04/2004
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Publication #:
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Pub Dt:
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12/29/2005
| | | | |
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Title:
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METHOD AND SYSTEM FOR TRACKING GOODS
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Patent #:
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Issue Dt:
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11/28/2006
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Application #:
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10860071
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Filing Dt:
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06/04/2004
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Publication #:
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Pub Dt:
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12/08/2005
| | | | |
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Title:
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RADIO FREQUENCY DEVICE FOR TRACKING GOODS
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Patent #:
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Issue Dt:
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01/02/2007
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Application #:
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10882167
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Filing Dt:
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07/02/2004
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Publication #:
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Pub Dt:
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01/05/2006
| | | | |
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Title:
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CIRCUITIZED SUBSTRATE WITH SPLIT CONDUCTIVE LAYER, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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Issue Dt:
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01/02/2007
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Application #:
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10882170
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Filing Dt:
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07/02/2004
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Publication #:
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Pub Dt:
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01/05/2006
| | | | |
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Title:
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CIRCUITIZED SUBSTRATE WITH FILLED ISOLATION BORDER, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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Issue Dt:
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08/07/2007
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Application #:
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10900385
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Filing Dt:
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07/28/2004
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Publication #:
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Pub Dt:
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02/02/2006
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Title:
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CIRCUITIZED SUBSTRATE WITH INTERNAL ORGANIC MEMORY DEVICE, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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Issue Dt:
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05/16/2006
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Application #:
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10900386
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Filing Dt:
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07/28/2004
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Publication #:
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Pub Dt:
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02/02/2006
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Title:
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ELECTRICAL ASSEMBLY WITH INTERNAL MEMORY CIRCUITIZED SUBSTRATE HAVING ELECTRONIC COMPONENTS POSITIONED THEREON, METHOD OF MAKING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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Issue Dt:
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07/04/2006
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Application #:
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10915483
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Filing Dt:
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08/11/2004
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Publication #:
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Pub Dt:
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01/20/2005
| | | | |
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Title:
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CIRCUITIZED SUBSTRATE ASSEMBLY AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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12/05/2006
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Application #:
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10920235
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Filing Dt:
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08/18/2004
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Publication #:
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Pub Dt:
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10/13/2005
| | | | |
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Title:
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LOW MOISTURE ABSORPTIVE CIRCUITIZED SUBSTRATE, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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Issue Dt:
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05/31/2005
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Application #:
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10933260
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Filing Dt:
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09/03/2004
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Publication #:
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Pub Dt:
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02/03/2005
| | | | |
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Title:
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INFORMATION HANDLING SYSTEM UTILIZING CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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11/13/2007
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Application #:
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10953923
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Filing Dt:
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09/29/2004
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Publication #:
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Pub Dt:
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03/30/2006
| | | | |
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Title:
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CIRCUITIZED SUBSTRATE WITH IMPROVED IMPEDANCE CONTOL CIRCUITRY, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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Issue Dt:
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02/07/2006
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Application #:
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10955741
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Filing Dt:
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09/30/2004
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Publication #:
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Pub Dt:
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02/24/2005
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Title:
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HIGH SPEED CIRCUITIZED SUBSTRATE WITH REDUCED THRU-HOLE STUB, METHOD FOR FABRICATION AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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Issue Dt:
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08/08/2006
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Application #:
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10968929
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Filing Dt:
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10/21/2004
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Publication #:
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Pub Dt:
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05/11/2006
| | | | |
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Title:
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METHOD OF MAKING A CIRCUITIZED SUBSTRATE HAVING A PLURALITY OF SOLDER CONNECTION SITES THEREON
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Patent #:
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Issue Dt:
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11/15/2005
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Application #:
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10991451
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Filing Dt:
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11/19/2004
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Title:
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CIRCUITIZED SUBSTRATES UTILIZING THREE SMOOTH-SIDED CONDUCTIVE LAYERS AS PART THEREOF, METHOD OF MAKING SAME, AND ELECTRICAL ASSEMBLIES AND INFORMATION HANDLING SYSTEMS UTILIZING SAME
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Patent #:
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Issue Dt:
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06/10/2008
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Application #:
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10991532
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Filing Dt:
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11/19/2004
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Publication #:
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Pub Dt:
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05/25/2006
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS PART THEREOF
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Patent #:
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Issue Dt:
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04/11/2006
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Application #:
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11031074
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Filing Dt:
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01/10/2005
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Title:
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CAPACITOR MATERIAL WITH METAL COMPONENT FOR USE IN CIRCUITIZED SUBSTRATES, CIRCUITIZED SUBSTRATE UTILIZING SAME, METHOD OF MAKING SAID CIRCUITIZED SUBSTRATE, AND INFORMATION HANDLING SYSTEM UTILIZING SAID CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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06/02/2009
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Application #:
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11031085
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Filing Dt:
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01/10/2005
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Publication #:
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Pub Dt:
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07/13/2006
| | | | |
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Title:
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CAPACITOR MATERIAL FOR USE IN CIRCUITIZED SUBSTRATES, CIRCUITIZED SUBSTRATE UTILIZING SAME, METHOD OF MAKING SAID CIRCUITIZED SUBSTRATE, AND INFORMATION HANDLING SYSTEM UTILIZING SAID CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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12/30/2008
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Application #:
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11086323
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Filing Dt:
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03/23/2005
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Publication #:
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Pub Dt:
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10/06/2005
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Title:
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LOW MOISTURE ABSORPTIVE CIRCUITIZED SUBSTRATE WITH REDUCED THERMAL EXPANSION, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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Issue Dt:
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10/28/2008
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Application #:
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11086324
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Filing Dt:
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03/23/2005
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Publication #:
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Pub Dt:
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09/28/2006
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Title:
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ELECTRONIC CARD ASSEMBLY
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Patent #:
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Issue Dt:
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11/06/2007
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Application #:
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11110901
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Filing Dt:
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04/21/2005
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Publication #:
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Pub Dt:
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10/26/2006
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Title:
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INTERPOSER FOR USE WITH TEST APPARATUS
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Patent #:
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Issue Dt:
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11/13/2007
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Application #:
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11110919
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Filing Dt:
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04/21/2005
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Publication #:
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Pub Dt:
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10/26/2006
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Title:
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APPARATUS AND METHOD FOR MAKING CIRCUITIZED SUBSTRATES IN A CONTINUOUS MANNER
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Patent #:
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Issue Dt:
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11/09/2010
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Application #:
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11110920
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Filing Dt:
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04/21/2005
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Publication #:
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Pub Dt:
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10/26/2006
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Title:
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APPARATUS FOR MAKING CIRCUITIZED SUBSTRATES HAVING PHOTO-IMAGEABLE DIELECTRIC LAYERS IN A CONTINUOUS MANNER
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Patent #:
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Issue Dt:
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02/19/2008
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Application #:
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11127160
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Filing Dt:
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05/12/2005
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Publication #:
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Pub Dt:
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11/16/2006
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Title:
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MULTI-CHIP ELECTRONIC PACKAGE WITH REDUCED LINE SKEW AND CIRCUITIZED SUBSTRATE FOR USE THEREIN
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Patent #:
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Issue Dt:
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01/30/2007
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Application #:
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11128272
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Filing Dt:
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05/13/2005
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Publication #:
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Pub Dt:
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11/16/2006
| | | | |
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Title:
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PLATING METHOD FOR CIRCUITIZED SUBSTRATES
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Patent #:
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Issue Dt:
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08/07/2007
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Application #:
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11152048
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Filing Dt:
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06/15/2005
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Publication #:
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Pub Dt:
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12/21/2006
| | | | |
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Title:
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WIREBOND ELECTRONIC PACKAGE WITH ENHANCED CHIP PAD DESIGN, METHOD OF MAKING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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Issue Dt:
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06/26/2007
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Application #:
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11172786
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Filing Dt:
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07/05/2005
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Publication #:
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Pub Dt:
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07/13/2006
| | | | |
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Title:
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RESISTOR MATERIAL WITH METAL COMPONENT FOR USE IN CIRCUITIZED SUBSTRATES, CIRCUITIZED SUBSTRATE UTILIZING SAME, METHOD OF MAKING SAID CIRUITIZED SUBSTRATE, AND INFORMATION HANDLING SYSTEM UTILIZING SAID CIRUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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06/10/2008
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Application #:
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11172794
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Filing Dt:
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07/05/2005
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Publication #:
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Pub Dt:
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07/13/2006
| | | | |
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Title:
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METHOD OF MAKING AN INTERNAL CAPACITIVE SUBSTRATE FOR USE IN A CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAID CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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02/26/2008
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Application #:
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11177413
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Filing Dt:
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07/11/2005
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Publication #:
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Pub Dt:
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01/11/2007
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Title:
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METHOD OF MAKING MULTILAYERED CIRCUITIZED SUBSTRATE ASSEMBLY HAVING SINTERED PASTE CONNECTIONS
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Patent #:
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Issue Dt:
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03/11/2008
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Application #:
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11177442
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Filing Dt:
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07/11/2005
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Publication #:
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Pub Dt:
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01/11/2007
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Title:
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CIRCUITIZED SUBSTRATE WITH SINTERED PASTE CONNECTIONS, MULTILAYERED SUBSTRATE ASSEMBLY, ELECTRICAL ASSEMBLY AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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Issue Dt:
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08/06/2013
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Application #:
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11215206
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Filing Dt:
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08/31/2005
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Publication #:
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Pub Dt:
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08/17/2006
| | | | |
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Title:
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CIRCUITIZED SUBSTRATE UTILIZING THREE SMOOTH-SIDED CONDUCTIVE LAYERS AS PART THEREOF AND ELECTRICAL ASSEMBLIES AND INFORMATION HANDLING SYSTEMS UTILIZING SAME
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Patent #:
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Issue Dt:
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05/01/2007
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Application #:
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11216133
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Filing Dt:
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09/01/2005
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Publication #:
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Pub Dt:
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03/01/2007
| | | | |
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Title:
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METHOD AND APPARATUS FOR DEPOSITING CONDUCTIVE PASTE IN CIRCUITIZED SUBSTRATE OPENINGS
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Patent #:
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Issue Dt:
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01/09/2007
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Application #:
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11238960
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Filing Dt:
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09/30/2005
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Publication #:
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Pub Dt:
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02/02/2006
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Title:
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STACKED CHIP ELECTRONIC PACKAGE HAVING LAMINATE CARRIER AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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02/19/2008
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11242841
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Filing Dt:
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10/05/2005
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Publication #:
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Pub Dt:
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02/09/2006
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Title:
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CIRCUITIZED SUBSTRATE WITH CONDUCTIVE POLYMER AND SEED MATERIAL ADHESION LAYER
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Patent #:
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Issue Dt:
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10/28/2008
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Application #:
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11244180
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10/06/2005
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Publication #:
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Pub Dt:
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01/11/2007
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Title:
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CIRCUITIZED SUBSTRATE WITH SOLER-COATED MICROPARTICLE PASTE CONNECTIONS, MULTILAYERED SUBSTRATE ASSEMBLY, ELECTRICAL ASSEMBLY AND INFORMATION HANDLING SYSTEM UTILIZING SAME AND METHOD OF MAKING SAID SUBSTRATE
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Patent #:
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Issue Dt:
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01/16/2007
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Application #:
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11258092
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Filing Dt:
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10/26/2005
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Publication #:
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Pub Dt:
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02/23/2006
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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08/15/2006
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Application #:
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11259043
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Filing Dt:
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10/27/2005
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Publication #:
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Pub Dt:
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03/02/2006
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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04/26/2011
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Application #:
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11265287
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Filing Dt:
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11/03/2005
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Publication #:
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Pub Dt:
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03/16/2006
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Title:
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DIELECTRIC COMPOSITION FOR USE IN CIRCUITIZED SUBSTRATES AND CIRCUITIZED SUBSTRATE INCLUDING SAME
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Patent #:
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Issue Dt:
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10/31/2006
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Application #:
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11281456
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Filing Dt:
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11/18/2005
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Title:
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SUBSTRATE TEST APPARATUS AND METHOD OF TESTING SUBSTRATES
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Patent #:
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Issue Dt:
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12/08/2009
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11305073
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Filing Dt:
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12/19/2005
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Pub Dt:
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06/21/2007
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Title:
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METHOD OF IMPROVING ELECTRICAL CONNECTIONS IN CIRCUITIZED SUBSTRATES
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Patent #:
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NONE
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Application #:
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11324273
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Filing Dt:
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01/04/2006
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Publication #:
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Pub Dt:
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07/13/2006
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Title:
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Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
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Patent #:
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Issue Dt:
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06/03/2008
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Application #:
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11324432
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Filing Dt:
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01/04/2006
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Publication #:
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Pub Dt:
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07/19/2007
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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12/11/2007
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Application #:
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11327493
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Filing Dt:
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01/09/2006
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Publication #:
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Pub Dt:
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06/08/2006
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Title:
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METHOD OF TREATING CONDUCTIVE LAYER FOR USE IN A CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAID SUBSTRATE HAVING SAID CONDUCTIVE LAYER AS PART THEREOF
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Patent #:
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NONE
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Application #:
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11334445
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Filing Dt:
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01/19/2006
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Publication #:
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Pub Dt:
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06/08/2006
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Title:
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Method of making printed circuit board having varying depth conductive holes
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Patent #:
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Issue Dt:
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08/26/2008
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Application #:
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11349990
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Filing Dt:
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02/09/2006
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Publication #:
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Pub Dt:
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06/22/2006
| | | | |
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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03/18/2008
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Application #:
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11349998
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Filing Dt:
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02/09/2006
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Publication #:
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Pub Dt:
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06/15/2006
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE ASSEMBLY
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Patent #:
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Issue Dt:
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03/24/2009
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Application #:
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11350777
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Filing Dt:
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02/10/2006
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Publication #:
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Pub Dt:
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06/15/2006
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Title:
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INFORMATION HANDLING SYSTEM INCLUDING A CIRCUITIZED SUBSTRATE HAVING A DIELECTRIC LAYER WITHOUT CONTINUOUS FIBERS
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Patent #:
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Issue Dt:
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09/30/2008
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Application #:
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11352276
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Filing Dt:
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02/13/2006
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Publication #:
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Pub Dt:
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01/11/2007
| | | | |
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Title:
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METHOD OF MAKING A CAPACITIVE SUBSTRATE USING PHOTOIMAGEABLE DIELECTRIC FOR USE AS PART OF A LARGER CIRCUITIZED SUBSTRATE, METHOD OF MAKING SAID CIRCUITIZED SUBSTRATE AND METHOD OF MAKING AN INFORMATION HANDLING SYSTEM INCLUDING SAID CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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11/11/2008
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Application #:
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11352279
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Filing Dt:
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02/13/2006
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Publication #:
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Pub Dt:
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01/11/2007
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Title:
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METHOD OF MAKING A CAPACITIVE SUBSTRATE FOR USE AS PART OF A LARGER CIRCUITIZED SUBSTRATE, METHOD OF MAKING SAID CIRCUITIZED SUBSTRATE AND METHOD OF MAKING AN INFORMATION HANDLING SYSTEM INCLUDING SAID CIRCUITIZED SUBSTRATE
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Patent #:
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Issue Dt:
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09/30/2008
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Application #:
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11390386
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03/28/2006
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Publication #:
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Pub Dt:
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08/17/2006
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Title:
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FLUOROPOLYMER DIELECTRIC COMPOSITION FOR USE IN CIRCUITIZED SUBSTRATES AND CIRCUITIZED SUBSTRATE INCLUDING SAME
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Patent #:
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Issue Dt:
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12/08/2009
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Application #:
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11396711
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Filing Dt:
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04/04/2006
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Publication #:
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Pub Dt:
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10/04/2007
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Title:
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ADJUSTABLE THICKNESS THERMAL INTERPOSER AND ELECTRONIC PACKAGE UTILIZING SAME
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Patent #:
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03/25/2008
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Application #:
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11397713
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04/05/2006
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Publication #:
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Pub Dt:
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08/17/2006
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Title:
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METHOD OF PROVIDING PRINTED CIRCUIT BOARD WITH CONDUCTIVE HOLES AND BOARD RESULTING THEREFROM
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Patent #:
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Issue Dt:
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03/16/2010
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11401401
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04/11/2006
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Publication #:
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Pub Dt:
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09/28/2006
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Title:
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CIRCUITIZED SUBSTRATE WITH SHIELDED SIGNAL LINES AND PLATED-THRU-HOLES AND METHOD OF MAKING SAME, AND ELECTRICAL ASSEMBLY AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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Issue Dt:
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01/20/2009
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Application #:
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11429990
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05/09/2006
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Publication #:
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Pub Dt:
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09/14/2006
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH SIGNAL WIRE SHIELDING
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Patent #:
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Issue Dt:
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03/01/2011
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11438424
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05/23/2006
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Publication #:
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Pub Dt:
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11/29/2007
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Title:
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CAPACITIVE SUBSTRATE
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Patent #:
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Issue Dt:
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12/08/2009
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Application #:
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11454896
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06/19/2006
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Publication #:
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Pub Dt:
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12/20/2007
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Title:
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HIGH SPEED INTERPOSER
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Patent #:
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Issue Dt:
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02/23/2010
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11455183
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06/19/2006
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Publication #:
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Pub Dt:
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10/26/2006
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Title:
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METHOD OF MAKING A MULTI-CHIP ELECTRONIC PACKAGE HAVING LAMINATE CARRIER
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Patent #:
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Issue Dt:
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10/19/2010
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Application #:
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11482945
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07/10/2006
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Pub Dt:
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11/09/2006
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH FILLED ISOLATION BORDER
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Patent #:
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Issue Dt:
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12/22/2009
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Application #:
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11492029
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Filing Dt:
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07/25/2006
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Pub Dt:
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01/31/2008
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Title:
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PHOTORESIST COMPOSITION WITH ANTIBACTERIAL AGENT
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Patent #:
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Issue Dt:
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10/16/2012
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11500328
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08/08/2006
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Pub Dt:
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02/14/2008
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Title:
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CIRCUITIZED SUBSTRATE ASSEMBLY
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Patent #:
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Issue Dt:
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03/30/2010
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Application #:
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11541776
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10/03/2006
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Pub Dt:
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04/03/2008
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Title:
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HALOGEN-FREE CIRCUITIZED SUBSTRATE WITH REDUCED THERMAL EXPANSION, METHOD OF MAKING SAME, MULTILAYERED SUBSTRATE STRUCTURE UTILIZING SAME, AND INFORMATION HANDLING SYSTEM UTILIZING
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09/29/2009
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11590888
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11/01/2006
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Pub Dt:
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05/01/2008
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METHOD OF MAKING A CIRCUITIZED SUBSTRATE WITH ENHANCED CIRCUITRY AND ELECTRICAL ASSEMBLY UTILIZING SAID SUBSTRATE
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06/16/2009
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11598647
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11/14/2006
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Pub Dt:
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05/15/2008
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH SOLDER PASTE CONNECTIONS
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03/10/2009
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11607973
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12/04/2006
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04/05/2007
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INTERPOSER AND TEST ASSEMBLY FOR TESTING ELECTRONIC DEVICES
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05/12/2009
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11634287
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12/06/2006
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Pub Dt:
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04/26/2007
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Title:
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METHOD OF MAKING A PRINTED CIRCUIT BOARD WITH LOW CROSS-TALK NOISE
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Patent #:
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Issue Dt:
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05/27/2008
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11641810
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12/20/2006
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Pub Dt:
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06/28/2007
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH SPLIT CONDUCTIVE LAYER AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Patent #:
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NONE
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11650520
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01/08/2007
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Pub Dt:
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07/10/2008
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Title:
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Method of making circuitized substrate with solder balls having roughened surfaces, method of making electrical assembly including said circuitized substrate, and method of making multiple circuitized substrate assembly
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Issue Dt:
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10/06/2009
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11652633
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01/12/2007
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Pub Dt:
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07/17/2008
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Title:
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METHOD OF PROVIDING A PRINTED CIRCUIT BOARD WITH AN EDGE CONNECTION PORTION AND/OR A PLURALITY OF CAVITIES THEREIN
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Patent #:
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Issue Dt:
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12/14/2010
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11727314
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03/26/2007
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Pub Dt:
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10/02/2008
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Title:
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FLEXIBLE CIRCUIT ELECTRONIC PACKAGE WITH STANDOFFS
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Issue Dt:
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03/22/2011
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11730212
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03/30/2007
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Pub Dt:
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10/02/2008
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH SELECTED CONDUCTORS HAVING SOLDER THEREON
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Patent #:
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Issue Dt:
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11/30/2010
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11730404
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04/02/2007
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Pub Dt:
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10/02/2008
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Title:
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LED LIGHTING ASSEMBLY AND LAMP UTILIZING SAME
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Patent #:
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NONE
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11730761
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04/04/2007
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Pub Dt:
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08/02/2007
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Title:
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Non-flaking capacitor material, capacitive substrate having an internal capacitor therein including said non-flaking capacitor material, and method of making a capacitor member for use in a capacitive substrate
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Issue Dt:
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08/26/2008
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11730942
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04/05/2007
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Pub Dt:
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08/09/2007
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Title:
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METHOD OF MAKING SAME LOW MOISTURE ABSORPTIVE CIRCUITIZED SUBSTRAVE WITH REDUCED THERMAL EXPANSION
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Patent #:
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Issue Dt:
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09/21/2010
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11783306
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04/09/2007
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Pub Dt:
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10/09/2008
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Title:
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CIRCUITIZED SUBSTRATE WITH INTERNAL STACKED SEMICONDUCTOR CHIPS, METHOD OF MAKING SAME, ELECTRICAL ASSEMBLY UTILIZING SAME AND INFORMATION HANDLING SYSTEM UTILIZING SAME
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Issue Dt:
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12/08/2009
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11797232
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05/02/2007
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Pub Dt:
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08/30/2007
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Title:
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METHOD FOR MAKING A MULTILAYERED CIRCUITIZED SUBSTRATE
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Issue Dt:
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01/18/2011
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11797236
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05/02/2007
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06/26/2008
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METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH A RESISTOR
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Issue Dt:
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11/22/2011
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11802434
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05/23/2007
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09/27/2007
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Title:
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CIRCUITIZED SUBSTRATE WITH CONDUCTIVE PASTE, ELECTRICAL ASSEMBLY INCLUDING SAID CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAID SUBSTRATE
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03/30/2010
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11806685
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06/04/2007
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04/17/2008
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Title:
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CIRCUITIZED SUBSTRATE WITH INTERNAL RESISTOR, METHOD OF MAKING SAID CIRCUITIZED SUBSTRATE, AND ELECTRICAL ASSEMBLY UTILIZING SAID CIRCUITIZED SUBSTRATE
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05/11/2010
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11808140
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06/07/2007
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12/11/2008
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Title:
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METHOD OF PROVIDING A PRINTED CIRCUIT BOARD WITH AN EDGE CONNECTION PORTION
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02/05/2008
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11808596
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06/12/2007
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Pub Dt:
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10/25/2007
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Title:
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METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH INTERNAL ORGANIC MEMORY DEVICE
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Patent #:
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03/31/2009
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11822573
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07/09/2007
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11/01/2007
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Title:
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METHOD OF MAKING WIREBOND ELECTRONIC PACKAGE WITH ENHANCED CHIP PAD DESIGN
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