Patent Assignment Details
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| Reel/Frame: | 030370/0031 | |
| Pages: | 10 |
| | Recorded: | 05/07/2013 | | |
| Attorney Dkt #: | LSIL 125923D1 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE ADDRESS PREVIOUSLY RECORDED ON REEL 030260 FRAME 0394. ASSIGNOR(S) HEREBY CONFIRMS THE 1621 BARBER LANE MILPITAS, CALIFORNIA 95035. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/13/2013
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Application #:
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13093032
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Filing Dt:
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04/25/2011
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Publication #:
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Pub Dt:
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08/11/2011
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Title:
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SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURE THEREFORE
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Assignee
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| 1110 AMERICAN PARKWAY NE |
| ALLENTOWN, PENNSYLVANIA 18109 |
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Correspondence name and address
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HITT GAINES P.C.
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P.O. BOX 832570
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RICHARDSON, TX 75080
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