Patent Assignment Details
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| Reel/Frame: | 030434/0968 | |
| Pages: | 4 |
| | Recorded: | 05/17/2013 | | |
| Attorney Dkt #: | 15157-000201/US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/12/2014
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Application #:
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13896593
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Filing Dt:
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05/17/2013
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Publication #:
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Pub Dt:
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11/21/2013
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Title:
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METHOD FOR LOW TEMPERATURE WAFER BONDING AND BONDED STRUCTURE
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Assignee
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| 3000 LONG DONG AVE, BUILDING #5, SUITE 501B |
| ZHANGJIANG HIGH TECH PARK |
| SHANGHAI, CHINA 201203 |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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5445 CORPORATE DRIVE
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SUITE 200
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TROY, MI 48098
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