Patent Assignment Details
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| Reel/Frame: | 030500/0084 | |
| Pages: | 4 |
| | Recorded: | 05/29/2013 | | |
| Attorney Dkt #: | OGOSH251USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13989839
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Filing Dt:
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05/28/2013
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Publication #:
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Pub Dt:
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09/26/2013
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Title:
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Copper-Clad Laminate and Method for Manufacturing Same
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Assignee
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| 6-3, OTEMACHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8164 |
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Correspondence name and address
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WILLIAM BAK, HOWSON & HOWSON LLP
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501 OFFICE CENTER DRIVE
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SUITE 210
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FORT WASHINGTON, PA 19034
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05/06/2024 08:19 PM
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