Patent Assignment Details
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| Reel/Frame: | 030568/0109 | |
| Pages: | 4 |
| | Recorded: | 06/07/2013 | | |
| Attorney Dkt #: | OGOSH190AUSA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13912406
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Filing Dt:
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06/07/2013
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Publication #:
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Pub Dt:
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10/17/2013
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Title:
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Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using Same
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Assignee
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| 6-3, OTEMACHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8164 |
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Correspondence name and address
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WILLIAM BAK, HOWSON & HOWSON LLP
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501 OFFICE CENTER DRIVE
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SUITE 210
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FORT WASHINGTON, PA 19034
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