Patent Assignment Details
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| Reel/Frame: | 030605/0382 | |
| Pages: | 4 |
| | Recorded: | 06/13/2013 | | |
| Attorney Dkt #: | AI-664NPC1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/28/2015
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Application #:
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13866049
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Filing Dt:
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04/19/2013
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Publication #:
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Pub Dt:
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09/12/2013
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Title:
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SEMICONDUCTOR DEVICE BONDING WITH STRESS RELIEF CONNECTION PADS
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Assignee
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| 21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO-SHI, |
| KYOTO, JAPAN 615-8585 |
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Correspondence name and address
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RABIN & BERDO, PC
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1101 14TH STREET, N.W., SUITE 500
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WASHINGTON, DC 20005
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