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10/15/1996
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04/30/1996
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10/28/1997
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01/29/2002
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09/29/1998
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04/04/2000
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02/15/2000
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05/05/1998
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06/02/1998
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10/15/1996
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01/19/1999
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06/09/1998
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02/10/1997
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06/02/1998
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08/11/1998
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11/09/1999
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12/01/1998
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02/09/1999
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02/09/1999
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02/09/1999
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09/19/2000
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08/10/1999
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07/13/1999
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04/17/2001
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12/17/1998
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02/29/2000
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07/02/1998
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04/10/2001
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02/01/2000
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06/25/2002
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01/02/2001
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10/30/1998
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11/14/2000
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03/13/2001
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02/17/1999
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06/25/2002
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12/19/2000
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03/27/2001
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07/16/2002
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08/28/2001
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06/27/2000
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03/06/2001
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04/29/2003
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11/05/2002
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04/23/2002
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10/03/2000
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12/02/2003
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10/13/2000
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09/03/2002
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10/26/2000
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07/17/2001
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04/30/2002
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11/22/2000
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07/01/2003
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02/15/2001
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09/26/2002
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05/21/2002
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10/08/2002
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03/08/2001
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11/21/2002
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06/24/2003
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03/09/2001
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11/21/2002
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04/08/2003
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03/29/2001
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08/23/2001
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01/21/2003
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07/16/2001
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02/25/2003
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08/23/2001
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12/31/2002
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08/31/2001
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07/01/2003
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09/05/2001
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03/06/2003
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07/09/2002
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09/07/2001
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05/13/2003
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09/28/2001
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04/17/2003
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02/17/2004
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02/14/2002
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08/14/2003
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01/07/2003
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02/27/2002
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09/12/2002
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12/07/2004
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10/02/2003
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08/31/2004
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10/02/2003
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10/14/2003
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01/02/2003
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07/27/2004
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04/22/2004
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05/27/2004
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03/16/2004
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07/13/2004
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08/10/2004
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04/25/2006
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11/11/2004
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11/13/2003
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05/27/2008
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Application #:
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10820236
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Filing Dt:
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04/06/2004
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Publication #:
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Pub Dt:
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10/06/2005
| | | | |
Title:
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METHOD OF FORMING A METAL PATTERN ON A SUBSTRATE
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Patent #:
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Issue Dt:
|
08/14/2007
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Application #:
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10837109
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Filing Dt:
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04/30/2004
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Publication #:
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Pub Dt:
|
11/03/2005
| | | | |
Title:
|
SELECTIVE CATALYTIC ACTIVATION OF NON-CONDUCTIVE SUBSTRATES
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Patent #:
|
NONE
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Issue Dt:
|
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Application #:
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10876795
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Filing Dt:
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06/25/2004
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Publication #:
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Pub Dt:
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12/29/2005
| | | | |
Title:
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Pulse reverse electrolysis of acidic copper electroplating solutions
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Patent #:
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|
Issue Dt:
|
04/04/2006
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Application #:
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10925589
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Filing Dt:
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08/25/2004
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Publication #:
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Pub Dt:
|
03/02/2006
| | | | |
Title:
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INTEGRAL PLATED RESISTOR AND METHOD FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS COMPRISING THE SAME
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Patent #:
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Issue Dt:
|
02/12/2008
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Application #:
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10943113
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Filing Dt:
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09/16/2004
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Publication #:
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Pub Dt:
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03/16/2006
| | | | |
Title:
|
CONTROLLING THE HARDNESS OF ELECTRODEPOSITED COPPER COATINGS BY VARIATION OF CURRENT PROFILE
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|
Patent #:
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NONE
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Issue Dt:
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Application #:
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10956912
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Filing Dt:
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09/30/2004
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Publication #:
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Pub Dt:
|
03/30/2006
| | | | |
Title:
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Melamine-formaldehyde post-dip composition for improving adhesion of metal to polymer
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|
Patent #:
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Issue Dt:
|
05/08/2007
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Application #:
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10964212
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Filing Dt:
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10/13/2004
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Publication #:
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Pub Dt:
|
04/13/2006
| | | | |
Title:
|
PROCESS FOR PREPARING A NON-CONDUCTIVE SUBSTRATE FOR ELECTROPLATING
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|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
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11049828
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Filing Dt:
|
02/03/2005
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Publication #:
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|
Pub Dt:
|
11/03/2005
| | | | |
Title:
|
Selective catalytic activation of non-conductive substrates
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|
Patent #:
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|
Issue Dt:
|
04/27/2010
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Application #:
|
11205516
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Filing Dt:
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08/17/2005
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Publication #:
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Pub Dt:
|
02/22/2007
| | | | |
Title:
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PRETREATMENT OF MAGNESIUM SUBSTRATES FOR ELECTROPLATING
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|
Patent #:
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|
Issue Dt:
|
07/01/2008
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Application #:
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11209471
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Filing Dt:
|
08/23/2005
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Publication #:
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|
Pub Dt:
|
03/08/2007
| | | | |
Title:
|
MICROETCHING SOLUTION
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|
Patent #:
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|
Issue Dt:
|
08/22/2006
|
Application #:
|
11290118
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Filing Dt:
|
11/30/2005
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Title:
|
DEVELOPER SOLUTION AND PROCESS FOR USE
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|
Patent #:
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|
Issue Dt:
|
09/30/2008
|
Application #:
|
11300254
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Filing Dt:
|
12/14/2005
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Publication #:
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|
Pub Dt:
|
06/14/2007
| | | | |
Title:
|
METHOD OF USING ULTRASONICS TO PLATE SILVER
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|
Patent #:
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Issue Dt:
|
11/25/2008
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Application #:
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11316010
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Filing Dt:
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12/21/2005
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Publication #:
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Pub Dt:
|
06/21/2007
| | | | |
Title:
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MICROETCHING COMPOSITION AND METHOD OF USING THE SAME
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Patent #:
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Issue Dt:
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10/09/2007
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Application #:
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11348941
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Filing Dt:
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02/06/2006
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Publication #:
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|
Pub Dt:
|
06/15/2006
| | | | |
Title:
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METHOD FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS WITH PLATED RESISTORS
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|
Patent #:
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|
Issue Dt:
|
02/23/2010
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Application #:
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11386631
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Filing Dt:
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03/22/2006
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Publication #:
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|
Pub Dt:
|
09/27/2007
| | | | |
Title:
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POLYIMIDE SUBSTRATE AND METHOD OF MANUFACTURING PRINTED WIRING BOARD USING THE SAME
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|
Patent #:
|
NONE
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Issue Dt:
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|
Application #:
|
11386901
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Filing Dt:
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03/22/2006
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Publication #:
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Pub Dt:
|
09/27/2007
| | | | |
Title:
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Precoat composition for organic solderability preservative
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Patent #:
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Issue Dt:
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08/18/2009
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Application #:
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11398048
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Filing Dt:
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04/05/2006
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Publication #:
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|
Pub Dt:
|
10/11/2007
| | | | |
Title:
|
PROCESS FOR ELECTROLYTICALLY PLATING COPPER
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|
|
Patent #:
|
NONE
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Issue Dt:
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|
Application #:
|
11398080
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Filing Dt:
|
04/05/2006
|
Publication #:
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|
Pub Dt:
|
10/11/2007
| | | | |
Title:
|
Process for creating a pattern on a copper surface
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|
Patent #:
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|
Issue Dt:
|
12/26/2006
|
Application #:
|
11403628
|
Filing Dt:
|
04/13/2006
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Title:
|
COPPER ELECTROPLATING OF PRINTING CYLINDERS
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|
Patent #:
|
NONE
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Issue Dt:
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|
Application #:
|
11479692
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Filing Dt:
|
06/30/2006
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Publication #:
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|
Pub Dt:
|
01/03/2008
| | | | |
Title:
|
Process for increasing the adhesion of a metal surface to a polymer
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|
|
Patent #:
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|
Issue Dt:
|
04/27/2010
|
Application #:
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11503780
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Filing Dt:
|
08/14/2006
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Publication #:
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|
Pub Dt:
|
02/14/2008
| | | | |
Title:
|
PROCESS FOR IMPROVING THE ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES
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|
|
Patent #:
|
NONE
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Issue Dt:
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Application #:
|
11657833
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Filing Dt:
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01/24/2007
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Publication #:
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Pub Dt:
|
07/24/2008
| | | | |
Title:
|
Second surface metallization
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|