Patent Assignment Details
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| Reel/Frame: | 030764/0284 | |
| Pages: | 3 |
| | Recorded: | 07/10/2013 | | |
| Attorney Dkt #: | 092977D1C4C1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/06/2011
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Application #:
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12493258
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Filing Dt:
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06/29/2009
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Publication #:
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Pub Dt:
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10/22/2009
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Title:
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LOW FABRICATION COST, FINE PITCH AND HIGH RELIABILITY SOLDER BUMP
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Assignee
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| 21, R&D FIRST ROAD |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN |
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Correspondence name and address
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QUALCOMM INCORPORATED
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5775 MOREHOUSE DRIVE
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SAN DIEGO, CA 92121-1714
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