Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 030764/0399 | |
| Pages: | 3 |
| | Recorded: | 07/10/2013 | | |
| Attorney Dkt #: | 093077B1C2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/06/2012
|
Application #:
|
12001676
|
Filing Dt:
|
12/12/2007
|
|
Publication #:
|
|
Pub Dt:
|
05/29/2008
| | | | |
|
Title:
|
TOP LAYERS OF METAL FOR INTEGRATED CIRCUITS
|
|
|
Assignee
|
|
|
|
|
| 21, R&D FIRST ROAD |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN |
|
|
Correspondence name and address
|
| |
QUALCOMM INCORPORATED
|
| |
5775 MOREHOUSE DRIVE
|
| |
SAN DIEGO, CA 92121-1714
|
Search Results as of:
05/14/2024 09:29 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
