Patent Assignment Details
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Reel/Frame: | 030783/0893 | |
| Pages: | 3 |
| | Recorded: | 07/12/2013 | | |
Attorney Dkt #: | 092966C1 AR |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/23/2011
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Application #:
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12132626
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Filing Dt:
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06/04/2008
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Publication #:
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Pub Dt:
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10/30/2008
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Title:
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SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVATION LAYER
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Assignee
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NO. 21, R&D 1ST ROAD, SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN ROC |
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Correspondence name and address
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QUALCOMM INCORPORATED
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5775 MOREHOUSE DRIVE
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SAN DIEGO, CA 92121-1714
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