Patent Assignment Details
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| Reel/Frame: | 030890/0560 | |
| Pages: | 4 |
| | Recorded: | 07/28/2013 | | |
| Attorney Dkt #: | 086206-0022 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13883252
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Filing Dt:
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07/26/2013
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Publication #:
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Pub Dt:
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11/14/2013
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Title:
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MIXED POWDER HIGH-DENSITY MOLDING METHOD AND MIXED POWDER HIGH-DENSITY MOLDING SYSTEM
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Assignee
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| 2-10, OHYAMA-CHO, MIDORI-KU |
| SAGAMIHARA-SHI, KANAGAWA, JAPAN 252-5181 |
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Correspondence name and address
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MCDERMOTT WILL & EMORY
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500 NORTH CAPITOL STREET NW
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WASHINGTON, DC 20001
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