Patent Assignment Details
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Reel/Frame: | 030952/0843 | |
| Pages: | 4 |
| | Recorded: | 08/06/2013 | | |
Attorney Dkt #: | 017491USA/ETCH/MME/MDD |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/30/2014
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Application #:
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13938537
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Filing Dt:
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07/10/2013
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Publication #:
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Pub Dt:
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01/16/2014
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Title:
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LASER, PLASMA ETCH, AND BACKSIDE GRIND PROCESS FOR WAFER DICING
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Assignee
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3050 BOWERS AVENUE |
SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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VANESSA L. YAZICIGIL
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1279 OAKMEAD PARKWAY
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SUNNYVALE, CA 94085-4040
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