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Patent Assignment Details
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Reel/Frame:031001/0493   Pages: 8
Recorded: 08/13/2013
Attorney Dkt #:3521.52
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 3
1
Patent #:
Issue Dt:
09/24/2013
Application #:
12787527
Filing Dt:
05/26/2010
Publication #:
Pub Dt:
09/16/2010
Title:
ELECTRICAL INTERCONNECT FORMING METHOD
2
Patent #:
Issue Dt:
09/24/2013
Application #:
13159773
Filing Dt:
06/14/2011
Publication #:
Pub Dt:
10/06/2011
Title:
THERMO-COMPRESSION BONDED ELECTRICAL INTERCONNECT STRUCTURE AND METHOD
3
Patent #:
Issue Dt:
11/12/2013
Application #:
13736627
Filing Dt:
01/08/2013
Publication #:
Pub Dt:
05/16/2013
Title:
UNDERFILL FLOW GUIDE STRUCTURES AND METHOD OF USING SAME
Assignor
1
Exec Dt:
08/05/2013
Assignee
1
3050 ZANKER ROAD
SAN JOSE, CALIFORNIA 95134
Correspondence name and address
ALLSTON L. JONES
425 SHERMAN AVENUE, SUITE 230
PALO ALTO, CA 94306

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