Patent Assignment Details
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Reel/Frame: | 031020/0412 | |
| Pages: | 4 |
| | Recorded: | 08/15/2013 | | |
Attorney Dkt #: | 28503-012 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/19/2015
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Application #:
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13954046
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Filing Dt:
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07/30/2013
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Publication #:
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Pub Dt:
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02/05/2015
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Title:
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COPPER POST STRUCTURE FOR WAFER LEVEL CHIP SCALE PACKAGE
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Assignee
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NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN 300 |
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Correspondence name and address
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STEVEN J. LAUREANTI
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40 NORTH CENTER STREET, SUITE 200
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MESA, AZ 85201
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