Patent Assignment Details
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| Reel/Frame: | 031028/0331 | |
| Pages: | 4 |
| | Recorded: | 08/16/2013 | | |
| Attorney Dkt #: | MURATA-51219 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/28/2017
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Application #:
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13940373
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Filing Dt:
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07/12/2013
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Publication #:
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Pub Dt:
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11/14/2013
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Title:
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RESIN SEALED MODULE
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Assignee
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| 10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI |
| KYOTO, JAPAN 6178555 |
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Correspondence name and address
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JEFFREY J. SOPKO
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1801 E.9TH STREET
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SUITE 1200
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CLEVELAND, OH 44114
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