Total properties:
10
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Patent #:
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Issue Dt:
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06/18/2002
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Application #:
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08884228
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Filing Dt:
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06/27/1997
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Title:
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METHOD OF INJECTION MOLDED FLIP CHIP ENCAPSULATION
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Patent #:
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Issue Dt:
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02/26/2002
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Application #:
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09346356
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Filing Dt:
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07/02/1999
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Title:
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ELECTRONIC PACKAGE FPR ELECTRONIC COMPONENTS AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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04/16/2002
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Application #:
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09540172
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Filing Dt:
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03/31/2000
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Title:
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ELECTRONIC PACKAGE WITH HIGH DENSITY INTERCONNECT LAYER
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Patent #:
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Issue Dt:
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04/11/2006
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Application #:
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10040745
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Filing Dt:
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01/07/2002
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Publication #:
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Pub Dt:
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05/23/2002
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Title:
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METHOD OF MAKING AN ELECTRONIC PACKAGE
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Patent #:
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Issue Dt:
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06/13/2006
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Application #:
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10253725
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Filing Dt:
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09/24/2002
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Publication #:
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Pub Dt:
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01/30/2003
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Title:
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ELECTRONIC PACKAGE WITH OPTIMIZED LAMINATION PROCESS
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Patent #:
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Issue Dt:
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03/16/2010
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Application #:
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11678783
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Filing Dt:
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02/26/2007
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Publication #:
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Pub Dt:
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08/28/2008
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Title:
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LOCALIZED TEMPERATURE CONTROL DURING RAPID THERMAL ANNEAL
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Patent #:
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Issue Dt:
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06/29/2010
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Application #:
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11678799
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Filing Dt:
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02/26/2007
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Publication #:
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Pub Dt:
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08/28/2008
| | | | |
Title:
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LOCALIZED TEMPERATURE CONTROL DURING RAPID THERMAL ANNEAL
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Patent #:
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Issue Dt:
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05/25/2010
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Application #:
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11744621
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Filing Dt:
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05/04/2007
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Publication #:
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Pub Dt:
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09/06/2007
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Title:
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METHODOLOGY FOR RECOVERY OF HOT CARRIER INDUCED DEGRADATION IN BIPOLAR DEVICES
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Patent #:
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Issue Dt:
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04/27/2010
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Application #:
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11752382
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Filing Dt:
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05/23/2007
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Publication #:
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Pub Dt:
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11/27/2008
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Title:
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METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RICH SOLDER ALLOY
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Patent #:
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Issue Dt:
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03/09/2010
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Application #:
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11850767
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Filing Dt:
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09/06/2007
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Publication #:
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Pub Dt:
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06/26/2008
| | | | |
Title:
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MOUNTING METHOD FOR SEMICONDUCTOR PARTS ON CIRCUIT SUBSTRATE
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