Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 031107/0961 | |
| Pages: | 3 |
| | Recorded: | 08/29/2013 | | |
| Attorney Dkt #: | CA920130011US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/18/2015
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Application #:
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14013182
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Filing Dt:
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08/29/2013
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Publication #:
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Pub Dt:
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03/05/2015
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Title:
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JOINING A CHIP TO A SUBSTRATE WITH SOLDER ALLOYS HAVING DIFFERENT REFLOW TEMPERATURES
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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IBM CORP - FISHKILL DRAFTING CENTER
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2070 ROUTE 52
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BLDG 321 M/D 482
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HOPEWELL JUNCTION, NY 12533
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