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Reel/Frame:031201/0342   Pages: 4
Recorded: 09/13/2013
Attorney Dkt #:085946-0325
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
14026134
Filing Dt:
09/13/2013
Publication #:
Pub Dt:
03/20/2014
Title:
INSULATING COMPOSITION FOR MULTILAYER PRINTED CIRCUIT BOARD, METHOD FOR PREPARING THE SAME, AND MULTILAYER PRINTED CIRCUIT BOARD COMPRISING THE SAME AS INSULATING LAYER
Assignors
1
Exec Dt:
11/05/2012
2
Exec Dt:
11/05/2012
3
Exec Dt:
11/05/2012
4
Exec Dt:
11/05/2012
Assignee
1
150, MAEYEONG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-743
Correspondence name and address
MCDERMOTT WILL & EMERY LLP
THE MCDERMOTT BUILDING
500 NORTH CAPITOL STREET, N.W.
WASHINGTON, DC 20001

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