Patent Assignment Details
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| Reel/Frame: | 031217/0717 | |
| Pages: | 5 |
| | Recorded: | 09/17/2013 | | |
| Attorney Dkt #: | P53518US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/13/2015
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Application #:
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14028577
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Filing Dt:
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09/17/2013
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Publication #:
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Pub Dt:
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03/19/2015
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Title:
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METHOD OF MANUFACTURING A CHIP PACKAGE, CHIP PACKAGE, METHOD OF MANUFACTURING A CHIP ASSEMBLY AND CHIP ASSEMBLY
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Assignee
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| AM CAMPEON 1-12 |
| NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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VIERING, JENTSCHURA & PARTNER - INF
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3770 HIGHLAND AVE.
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SUITE 203
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MANHATTAN BEACH, CA 90266
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