Patent Assignment Details
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| Reel/Frame: | 031235/0595 | |
| Pages: | 20 |
| | Recorded: | 09/18/2013 | | |
| Attorney Dkt #: | 131167 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/29/2016
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Application #:
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14030662
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Filing Dt:
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09/18/2013
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Publication #:
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Pub Dt:
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04/24/2014
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Title:
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SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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Assignee
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| 2-10-23 SHIN-YOKOHAMA, KOHOKU-KU |
| YOKOHAMA-SHI, KANAGAWA, JAPAN 222-0033 |
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Correspondence name and address
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WESTERMAN, HATTORI, DANIELS & ADRIAN, LL
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1250 CONNECTICUT AVENUE, NW
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SUITE 700
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WASHINGTON, DC 20036
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