Patent Assignment Details
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| Reel/Frame: | 031258/0404 | |
| Pages: | 5 |
| | Recorded: | 09/23/2013 | | |
| Attorney Dkt #: | 15115/628001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/10/2015
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Application #:
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14000111
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Filing Dt:
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09/24/2013
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Publication #:
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Pub Dt:
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01/09/2014
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Title:
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WAFER LEVEL PACKAGE, CHIP SIZE PACKAGE DEVICE AND METHOD OF MANUFACTURING WAFER LEVEL PACKAGE
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Assignee
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| 801, MINAMIFUDODO-CHO; HORIKAWAHIGASHIIRU |
| SHIOKOJI-DORI, SHIMOGYO-KU; KYOTO-SHI |
| KYOTO, JAPAN 600-8530 |
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Correspondence name and address
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THOMAS K. SCHERER
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909 FANNIN ST.
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SUITE 3500
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HOUSTON, TX 77010
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