Patent Assignment Details
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| Reel/Frame: | 031303/0357 | |
| Pages: | 10 |
| | Recorded: | 09/27/2013 | | |
| Attorney Dkt #: | 27-895 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/08/2016
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Application #:
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14040413
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Filing Dt:
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09/27/2013
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Title:
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INTEGRATED CIRCUIT THROUGH-SUBSTRATE VIA SYSTEM WITH A BUFFER LAYER AND METHOD OF MANUFACTURE THEREOF
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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ISHIMARU & ASSOCIATES LLP
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2055 GATEWAY PLACE
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SUITE 700
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SAN JOSE, CA 95110
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