Patent Assignment Details
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| Reel/Frame: | 031364/0104 | |
| Pages: | 2 |
| | Recorded: | 10/08/2013 | | |
| Attorney Dkt #: | SUMIKO-330-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/05/2016
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Application #:
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14048450
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Filing Dt:
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10/08/2013
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Publication #:
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Pub Dt:
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04/17/2014
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Title:
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ADHESIVELESS COPPER CLAD LAMINATES AND PRINTED CIRCUIT BOARD HAVING ADHESIVELESS COPPER CLAD LAMINATES AS BASE MATERIAL
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Assignee
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| 11-3, SHIMBASHI 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8716 |
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Correspondence name and address
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HESPOS & PORCO LLP
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110 WEST 40TH STREET
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SUITE 2501
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NEW YORK, NY 10018
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