Patent Assignment Details
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| Reel/Frame: | 031427/0226 | |
| Pages: | 14 |
| | Recorded: | 10/17/2013 | | |
| Attorney Dkt #: | S&P-51435 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/01/2019
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Application #:
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13982686
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Filing Dt:
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10/17/2013
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Publication #:
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Pub Dt:
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02/06/2014
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Title:
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BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE BONDING METHOD, BONDING-SUBSTRATE FABRICATION APPARATUS, AND SUBSTRATE ASSEMBLY
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Assignees
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| 1-25, NISHINOHATA OKUBO-CHO, UJI-SHI |
| KYOTO, JAPAN |
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| 16-20, UENO 6-CHOME, TAITO-KU |
| TOKYO, JAPAN |
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| 38-2, YOYOGI 1-CHOME, SHIBUYA-KU |
| TOKYO, JAPAN |
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| 6-3, HIGASHINAKANO 3-CHOME, NAKANO-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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PEARNE & GORDON LLP
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1801 E 9TH ST.
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SUITE 1200
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CLEVELAND, OH 44135
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