Patent Assignment Details
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| Reel/Frame: | 031450/0853 | |
| Pages: | 4 |
| | Recorded: | 10/22/2013 | | |
| Attorney Dkt #: | (0553-1126) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/07/2016
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Application #:
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14059660
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Filing Dt:
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10/22/2013
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Publication #:
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Pub Dt:
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05/01/2014
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Title:
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Method for Bonding Substrates, Method for Manufacturing Sealing Structure, and Method for Manufacturing Light-Emitting Device
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Assignee
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| 398 HASE |
| ATSUGI-SHI |
| KANAGAWA-KEN, JAPAN 243-0036 |
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Correspondence name and address
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HUSCH BLACKWELL LLP
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120 S RIVERSIDE PLAZA
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22ND FLOOR
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CHICAGO, IL 60606
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