Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 031561/0405 | |
| Pages: | 14 |
| | Recorded: | 11/07/2013 | | |
| Attorney Dkt #: | 10-276 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/30/2016
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Application #:
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14074057
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Filing Dt:
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11/07/2013
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Publication #:
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Pub Dt:
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05/07/2015
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Title:
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POWER DOUBLER AMPLIFIER MODULE WITH IMPROVED SOLDER COVERAGE BETWEEN A HEAT SINK AND A THERMAL PAD OF A CIRCUIT PACKAGE
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Assignee
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| 170 WEST TASMAN DRIVE |
| SAN JOSE, CALIFORNIA 95134-1706 |
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Correspondence name and address
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CISCO C/O LEON R TURKEVICH MANELLI SELTE
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2000 M STREET, NW
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SUITE 700
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WASHINGTON, DC 20036-3307
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