Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 031578/0348 | |
| Pages: | 8 |
| | Recorded: | 11/11/2013 | | |
| Attorney Dkt #: | TAIY-0005 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
14116979
|
Filing Dt:
|
12/18/2013
|
|
Publication #:
|
|
Pub Dt:
|
05/08/2014
| | | | |
|
Title:
|
EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE
|
|
|
Assignee
|
|
|
|
|
| 9-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-6606 |
|
|
Correspondence name and address
|
| |
STITES & HARBISON PLLC
|
| |
1199 NORTH FAIRFAX STREET
|
| |
SUITE 900
|
| |
ALEXANDRIA, VA 22314
|
Search Results as of:
05/07/2024 08:27 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
