Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 031628/0409 | |
| Pages: | 4 |
| | Recorded: | 11/19/2013 | | |
| Attorney Dkt #: | T5057-K167A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/10/2015
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Application #:
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14083521
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Filing Dt:
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11/19/2013
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Publication #:
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Pub Dt:
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03/13/2014
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Title:
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SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ASSEMBLY WITH LEAD-FREE SOLDER
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Assignee
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| NO. 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-77 |
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Correspondence name and address
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LOWE HAUPTMAN & HAM, LLP (TSMC)
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2318 MILL ROAD
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SUITE 1400
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ALEXANDRIA, VA 22314
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