Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 031664/0011 | |
| Pages: | 3 |
| | Recorded: | 11/24/2013 | | |
| Attorney Dkt #: | SW-972284; SW-401 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14088421
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Filing Dt:
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11/24/2013
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Publication #:
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Pub Dt:
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05/28/2015
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Title:
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HALOGEN-FREE EPOXY RESIN COMPOSITION FOR INTEGRATED CIRCUIT PACKAGING
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Assignees
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| BEICE VILLAGE, HUMEN TOWN |
| DONGGUAN CITY, GUANGDONG PROVINCE, CHINA |
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| NO. 22, KUNG YE 1ST RD., PING CHEN CITY |
| TAOYUAN COUNTY, TAIWAN |
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Correspondence name and address
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INT'L PATENT OFFICE OF BANG SHIA
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102 LINDENCREST CT
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SUGAR LAND, TX 77479-5201
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