Patent Assignment Details
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| Reel/Frame: | 031691/0856 | |
| Pages: | 4 |
| | Recorded: | 11/29/2013 | | |
| Attorney Dkt #: | 424865US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/25/2017
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Application #:
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14123129
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Filing Dt:
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11/29/2013
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Publication #:
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Pub Dt:
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04/10/2014
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Title:
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COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOTTOM-UP FILLING OF THOUGH SILICON VIAS AND INTERCONNECT FEATURES
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Assignee
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| LUDWIGSHAFEN, GERMANY 67056 |
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Correspondence name and address
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OBLON, SPIVAK, ET AL.
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1940 DUKE STREET
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ALEXANDRIA, VA 22314
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05/09/2024 07:05 AM
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