Patent Assignment Details
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| Reel/Frame: | 031776/0507 | |
| Pages: | 5 |
| | Recorded: | 12/12/2013 | | |
| Attorney Dkt #: | P7359US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/11/2017
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Application #:
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14105154
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Filing Dt:
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12/12/2013
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Publication #:
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Pub Dt:
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06/18/2015
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Title:
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Apparatus and Method for Fast Evaluation of Electroplating Formulation Performance in Microvia Filling
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Assignee
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| 3/F, BIO-INFORMATICS CENTRE, 2 SCIENCE PARK WEST AVENUE, HONG KONG SCIENCE PARK, SHATIN, NEW TERRITORIES |
| HONG KONG, HONG KONG |
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Correspondence name and address
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ELLA CHEONG HONG KONG
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5001 HOPEWELL CENTRE
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183 QUEEN''S ROAD EAST, WAN CHAI
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HONG KONG, HONG KONG
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