Patent Assignment Details
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| Reel/Frame: | 031862/0428 | |
| Pages: | 4 |
| | Recorded: | 12/31/2013 | | |
| Attorney Dkt #: | TSM13-1539 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/16/2018
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Application #:
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14144913
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Filing Dt:
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12/31/2013
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Publication #:
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Pub Dt:
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07/02/2015
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Title:
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WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF FORMING SAME
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Assignee
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| NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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SLATER & MATSIL, L.L.P.
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17950 PRESTON ROAD, SUITE 1000
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DALLAS, TX 75252
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